DIFFERENT TYPE OF CELLS

STDCELLS-------------------->Nothing But Base cells(Gates,flops).

TAP CELLS-------------------->Avoids Latch up Problem(Placing these cells with a particular distance).

TIE CELLS--------------------->It is used for preventing Damage of cells; Tie High cell(Gate One input is connected to Vdd, another input is connected to signal net);Tie low cells Gate one input is connected to Vss, another input is connected to signal .

END CAP CELLS------------->To Know the end of the row,and At the edges endcap cells are placed to avoid the cells damages at the end of the row to avoid wrong laser wavelength for correct manufacturing.

DECAP CELLS---------------->Charge Sharing;To avoid the Dynamic IR drop ,charge stores in the cells and release the charge to Nets.

ICG CELLS----------------------->Clock gating cells ,to avoid Dynamic power Dissipation.

POWER GATING CELLS---->Power gating to avoid static power Dissipation.

PAD CELLS ----------------------->To Interface with outside Devices;Input to of Power,Clock,Pins are connected to pad cells and outside also.

CORNER CELLS---------------->Corner Pads are used for Well Continity.

Macro cells------------------------->Memories.

Spare Cells-------------------------->Used at the ECO.

Pad filler cells----------------------->Used for Well Continity,placed in between Pads,Std cells.

JTAG CELLS---------------------->These are used to check the IO connectivity.