Wednesday 12 November 2014

Copper Piller

Cu-Piller 


Copper pillar bump(CPB) technology is to produce a bump on the surface of Flip chip package which has the electric and heat conductivity and the resistance to electrical migration. It’s different from the traditional solder bump. Each heat dissipation copper pillar is the same as the micro-solid heat pump. The heat dissipation bumping can integrate to a part of the standard flip chip package and is connected with the electric bumping (uses on power supply、grounding and signal). The technique provides the new heat dissipation function of the electronic component which can also integrate with transistor, resistor and capacitor to the circuit design.
This technique will extend the traditional solder bumping application and provides flip chip package component to initially cooling function. Its electric generate ability has copper pillar used the recycle energy. Before this technique, the solder bumping can only provide the mechanical heat dissipation function.
 

Features 

Good Heat dissipation
lower electrical resistance/inductivity
lower thermal resistance
better resistance to electrical migration
Offer the more fine pitch
Comply with RoHS specification - Cu post + SnAg cap
 

Application: 

High pin logic IC
Memory & Mobile Apparatus
LED Sub-mount
Automotive Electronic Component
Bio-Medical devices
 

Process Flow:





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